JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. 

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.

Milestones

1972

Jiangyin Transistor Factory Established

1989

First Automated IC Assembly Line Started Production

2000

Company Restructured to JCET

2003

JCET Listed on Shanghai Stock Exchange

2003

JCAP Established

2011

JCET D8 (Suqian) Established

2012

JCET D9 (Chuzhou) Established

2015

JCET Acquired STATS ChipPAC

2020

JCET Management Co., Ltd. Established